features * plastic package has underwriters laboratories flammability classification 94v-0 * ideally suited for use in very high frequency switching * power supplies, inverters and as free wheeling diodes * ultrafast recovery time for high efficiency * excellent high temperature switching * soft recovery characteristics * cavity-free glass passivated junction * high temperature soldering guaranteed: * 260 c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case : jedec do-214ac, molded plastic over glass die terminals : plated axial leads, solderable per mil-std-750, method 2026 polarity : color band denotes cathode end mounting position : anywe declare that the material of product compliance weight : 0.0023 oz., 0.065 g with rohs requirements handling precautin :none 1.electrical characteristic maximum & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol hfm 101 hfm 102 hfm 103 hfm 104 hfm 105 hfm 106 hfm 107 hfm 108 unit marking hf1hf2hf3hf4hf5hf6hf7hf8 maximum repetitive peak reverse voltage v rrm 50100200300400600 8001000v maximum rsm voltage v rsm 3570140210280420560700 v maximum dc blocking voltage v dc 501002003004006008001000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 75 c if(av) a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm a maximum full load reverse current, full cycle average,0.375"(9.5mm) lead lengths at t a = 55 c ir(av) a typical thermal resistance (note 2) r ja c/w operating junction and storage temperature range tj, tstg c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol hfm 101 hfm 102 hfm 103 hfm 104 hfm 105 hfm 106 hfm 107 hfm 108 unit maximum instantaneous forward voltage at 1.0a v f v maximum dc reverse current ta = 25 c at rated dc blocking voltage ta = 100 c ir a typical reverse recovery time (note 1) trrns typical junction capacitance at 4.0v, 1mhz cjpf notes: 1. if = 0.5a, ir = 1.0a, irr = 0.25a 2. thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, p.c.b. mounted 75 17 1.0 30 100 50 HFM101 thru hfm108 surface mount glass passivated high efficiency rectifiers reverse voltage 50 to 1000v forward current 1.0a C 50 to +150 1.001.30 50 1.85 5.0 50
2.ratings and characteristic curves ( ta = 25 c unless otherwise noted ) HFM101 thru hfm108 fig. 1 C forward current derating curve fig. 2 C maximum non-repetitive peak forward surge current fig 4. C typical reverse characteristics fig 3. C typical instantaneous forward characteristics fig 5. C typical transient thermal impedance fig 6. C typical junction capacitance a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) i n s t a n t a n e o u s r e v e r s e c u r r e n t ( a ) j u n c t i o n c a p a c i t a n c e ( p f ) 0 25 50 75 100 125 150 175 1 10 100 0.8 1.0 1.2 1.4 1.6 1.80 20 40 60 80 100 0.1 1 10 100 20 10 1.0 100 10 1.0 0.1 0.01 1.0 0.1 0.01 0.001 10 1.0 0.5 0 50 40 30 20 10 0 60 hz resistive or inductive load 0.375" (9.5mm) lead length tj = tj max 8.3ms single half sine-wave (jedec method) tj = 25 c pulse width = 300 s 1% duty cycle tj = 25 c f = 1.0 mhz vsig = 50mvp-p ambient temperature, c number of cycles at 60hz instantaneous forward voltage (v)percent of rated peak reverse voltage (%) reverse voltage (v) tj=125 tj=75 tj=25 t r a n s i e n t t h e r m a l i m p e d a n c e ( c / w ) 10 1.0 0.1 100 0.01 0.1 1.0 10 100 t,pulse duration,sec
3. dimension: HFM101 thru hfm108
titile: 1.1 ? reel a. ? reel spec mm abcw 177.0 2.054.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.5 0.5 330.0 2.075.0 0.513.0 0.517.0 0.5 b. 13" ? inner box mm abc ? 335 5.0335 2.040 1.0 ?? ? ?? quantity ? 10k 6k 6k smb13" smc13" ? 2k 5k 3k 3k sma13" sma 7" sma13" smc13" smb13" ?? wi-258 ? smd ??Z 3 0 ? 2 ? smd ??e????? packaging specification of smd general packaging materials spec. and quantity
titile: c. 7" ? box mm abc ? 188 2.0188 2.0138 2.0 ?? ? ?? quantity 7" d. reel carton mm abc ? 350 2.0340 2.0350 2.0 ?? ? ?? ? 80k 80k 48k 36k 1.2 tape spec a. cover tape mm a sma smb smc13.30 0.10 smb13" smc13" 9.30 0.10 0.068 0.005 b packaging specification of smd 3 ? 16k ? sma 7" sma13" ?? wi-258 ? smd ??Z ?? wi-258
titile: b. sma smb smc w12 0.3 12 0.3 16 0.3 p14 0.1 8 0.1 8 0.1 e1.75 0.1 1.75 0.1 1.75 0.1 f5.5 .05 5.5 0.05 7.5 .05 d01.55 0.05 1.55 0.05 1.55 0.05 d11.5 0.1 1.55 0.05 1.55 0.05 p04 0.1 4 0.1 4 0.1 p22 0.05 2 0.05 2 0.05 10p040 0.2 40 0.2 40 0.2 a02.79 0.1 3.8 0.1 6.05 0.1 b05.33 0.1 5.4 0.1 8.31 0.1 k02.36 0.1 2.45 0.1 2.54 0.1 t0.25 0.05 0.25 0.05 0.25 0.05 2 smd ??e?Z general spec of smd 5.2.1 ?? domestic a. 7" reel ??? all the label on cathode side a : lrc ? ; b : rohs ? c : ? hf label b. 13" ??? all the label on cathode side ? hf only a : lrc ? ; b : rohs ? c : ? ? hf only 4 ? ? smd ??Z 3 0 ? ?? wi-258 packaging specification of smd a a a k o sec.:a-a' ao p2 p1 a do w e f a' b po b' b o sec.:b-b' t d1 c c c c ? ( ??
titile: c. ? ? label spec lrc ? label rohs ? ? hf label ??? all the label on cathode side overseas 13" ? inner box a : lrc ? ; b : rohs ? c : ? hf label ? hf only 5 ? 7" ? inner box packaging specification of smd ?? wi-258 ? smd ??Z 3 0 ? 2.2 ? a a ****** ****** ****** ****** lrc ? type ? quantity ? date ? lot green c c c
titile: lrc ? label rohs ? ? hf label ? note: 1. 13" ?? ? , ? ? ;13"reel inner box must be packed by shrink film 2. ?? ? , ? ? ; every tape after packing must be fixed by white adhesive tape 3.1 ? l testing report of the oqc ?? ? l every lot must with test report 3.2 ? ? ? ?? ? ? ? ?? ? ? the same coding is only one ending for each batch box materials for the mantissa to be good filled with cushioning material. mark:****** q'ty:****** ?? wi-258 ? smd ??Z 3 0 ? 6 ? date:****** type:****** packaging specification of smd lrc ? ? ? ? green
4. update record 1 2 ??? HFM101 thru hfm108 ? 2012-8-2 ?? 2011-7-13
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